PacTech – Packaging Technologies GmbH (PacTech), ein renommierter Hersteller von lasergestützten Solder-Jetting- und Chip-Bonding-Anlagen sowie weltweit agierender Wafer-Level-Packaging-Dienstleister, freut sich, eine Investition von 10 Millionen US-Dollar zur Erweiterung der Kapazität seiner Tochtergesellschaft, PacTech Asia Sdn. Bhd. (PacTech Asia), mit Sitz in Penang, Malaysia, bekannt zu geben. Mit der erwarteten Erholung des Halbleitermarktes im Geschäftsjahr 2024 […]
continue readingPac Tech Asia Invests in Capacity Expansion of Malaysian Factory
Pac Tech Packaging Technologies GmbH (PacTech), a leading manufacturer of high-performance laser-assisted solder jetting and die bonding equipment, and a globally recognized wafer level packaging subcontractor, is proud to announce a $10 million investment to enhance the capacity of its subsidiary, PacTech Asia Sdn. Bhd. (PacTech Asia), located in Penang, Malaysia. With the semiconductor market […]
continue readingPac Tech – Packaging Technologies GmbH Appoints New Vice Presidents to Lead Business Units
Pac Tech – Packaging Technologies GmbH (PacTech), a renowned manufacturer of high-performance laser-assisted solder jetting and die bonding equipment, along with its role as a globally operating wafer level packaging subcontractor, proudly announces the internal promotions of Ms. Sy Jiun Sim and Mr. Matthias Fettke as Vice Presidents to lead key business units. Dr. Thorsten […]
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Forming of Advanced THT-Interconnects using SB² Laser Solder Jetting Process
Conventional methods of soldering THT-contacts face growing limitations with new-generation products. Finer pitches, more intricate geometries, more excellent aspect ratios, thermally sensitive substrates, and an overall call for a flux-free bonding require different process solutions. SB² laser assisted solder jetting process addresses these challenges and overcomes them. The process involves jetting a molten solder droplet […]
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