The Supervisory Board of LayTec AG has extended the contracts of the two members of the Managing Board ahead of schedule: Volker Blank and Dr. Kolja Haberland were appointed for additional five years to continue in their current role. This decision of the Supervisory Board is a clear signal of continuity and stability, essential for […]
continue readingLayTec to present its new EpiX cassette-to-cassette (C2C) mapping station at ICMOVPE XX in Stuttgart, Germany
After introducing its EpiX mapping station some years ago, LayTec is now bringing its newest EpiX generation to the market. The first demo unit of this novel metrology system will be displayed at LayTec‘s booth at ICMOVPE XX in Stuttgart, Germany from 10-14 July 2022. Just like previous EpiX generations, the novel system is equipped […]
continue readingKnowledge and Power: Oxford Instruments Plasma Technology and LayTec join forces to provide critical front end processing solutions for the production of compound semiconductor devices
Two technology leaders within the compound semiconductor industry, Oxford Instruments Plasma Technology and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTec’s accuracy and control with Oxford Instruments’ renowned wafer processing expertise. Together, they […]
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