To ensure that Innodisk’s DRAM modules and FLASH products can maintain their rated maximum temperatures, the products are subjected to a 48-hour temperature test on at least three different motherboards. In particular, DRAM modules undergo test cycles from +10° to +85°C for the Standard Temperature series, from -40° to +85°C for the Wide Temperature series and from -40° to +125°C for the Ultra Temperature series. Electronic components can experience corrosion from moisture in humid environments. To ensure that the DRAM modules and FLASH drives are not susceptible to this type of corrosion, the products are placed in a test chamber with a relative humidity of 95% and tested for functionality after 48 hours. To ensure functionality and durability during and after severe shocks, the modules are subjected to a vibration test and are thus certified according to MIL-STD-810G. Sudden temperature changes are also tested and certified according to the US military standard MIL-STD-810G. During the test, the temperature changes from -40° to +110°C within 5 minutes and goes through 500 cycles. During each cycle, both the low and high temperature patterns last 15 minutes each. Another test verifies that data can be correctly preserved and restored during and after an unexpected power failure and that no abnormal loss of performance has occurred.

The performance of the FLASH products is tested with CrystalDiskMark and the results are compared with the stated performance of the drive. Before the test, all data on the FLASH device is erased using Security Erase. In addition to this test, performance is also certified with a Linux FIO test and an AIDA64 test. The Garbage Collection & Trim test checks the ability of an SSD to organise and move data when the drive does not have enough space. The FLASHs are subjected to this test under both Windows 10 and Linux Ubuntu. TCG OPAL functionality is tested with the Ulink TCG OPAL test. TCG OPAL is responsible for the encryption and decryption of data on a device. The software and hardware security erase tests ensure that data is erased correctly and that the device functions normally after erasure. The software security erase tests are performed using a hard disk security test tool, and the hardware security erase tests are performed by shorting pins.

A warm start test checks that there are no problems when restarting. The performance of DRAM modules and FLASH drives is usually affected by constant shutdowns and reboots. Therefore, the products are sent through the boot process several hundred times and monitored during this process. Windows saves power by using sleep mode, where only the DRAM modules are powered so that data can be temporarily stored in them. The S3 cycle test wakes up the memory during sleep mode to ensure that data is stored correctly and no blue screen or automatic reboots occur. It also powers up other components, such as FLASH devices, after waking up and tests their functionality.

In some extreme environments, electronics can be exposed to a high percentage of sulfur, which can reduce conductivity and potentially lead to memory failure. The modules are therefore subjected to a sulfuration test and must meet the requirements of ASTM B809-95 certification, which confirms the resistance of the DIMMs to harsh environments. The PCB is tested according to the EIAJ-4702 standard of the Japan Electronics and Information Technology Industries Association. The certification tests the strength of the connection between the PCB and the solder balls by applying pressure. DRAM module pins are easily damaged when inserted and removed from motherboards. The robustness of the module pins is verified by putting the modules through 100 cycles of insertion and removal and then thoroughly testing the DIMMs for functionality. In addition to the S3 cycle tests, the FLASHs are also tested during S4 sleep and wake. This is the lowest power hibernation state where an image of the DRAM content is written to the FLASH drive and then all components are powered down. After waking up, the system reads the memory image stored in the FLASH drive and moves it back to the DRAM so that it is ready for regular operation.

To ensure that DRAM modules can operate on systems with different frequencies, they are tested on three or more different systems with different frequencies. For example, a 3200MT/s DDR4 module would also be tested on 2933MT/s, 2666MT/s, 2400MT/s and 2133MT/s systems.

Not all internal tests are performed on all delivered units. Customers can select which tests they would like to have performed when ordering.

Packaging quality is tested according to the International Safe Transit Association’s ISTA-1A standard. This ensures that the goods are delivered safely to the customer.

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In the industrial sector, reliability, robustness and compatibility are important criteria for memory products, in addition to capacity. To provide products of the highest quality, Innodisk subjects its products to a variety of internal tests.

Temperature tests ensure that DRAM modules and FLASH products can withstand their rated maximum temperatures. Humidity test, vibration test and abnormal power loss test in case of sudden power failure increase the reliability of the products. A performance test compares the actual performance with the specified performance. The Garbage Collection & Trim Test checks the ability of an SSD to organise and move data when the drive does not have enough space. TCG OPAL for data encryption and decryption is also tested in a special test procedure. Packaging quality is also tested according to the ISTA-1A standard. A warm start test and the power-on and power-off tests as well as the S3 cycle test provide additional security against data loss. The sulphuration test is performed according to ASTM B809-95 certification. PCB bend test and thermal shock test also check the physical robustness. The frequency compatibility test ensures that the modules operate at different frequencies.

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