The portfolio was specially developed for system integrators and network operators. The products offer a robust design, reliability, and complete form factor support for single and dual rank operations with high capacity for AI and IoT applications. They are designed for the extended industrial temperature range from -40 ° C to + 85 ° C. An anti-sulfur coating protects the DRAM silver alloys from sulfur corrosion and a HumiSeal coating prevents damage from dust, dirt, and corrosion. The soldering points between the chip and the circuit board are reinforced by special side-fill technology.

All DIMM types are available in DDR4 design. The Non-ECC and ECC DIMM/SODIMM and RDIMM variants are available in memory capacities of 4GB, 8GB, 16GB, and 32GB. The RDIMM VLP version is available in capacities of 16GB and 32GB.

"With industrial-grade DRAMs, it is possible to integrate FPGAs into applications like AI and IoT. We expect this to have a major impact on the market as AI grows," said Samson Chang, Global DRAM Vice President of Innodisk. "Innodisk’s DRAM modules provide the high-speed, high-capacity, low-latency memory access of FPGAs. We offer high-quality industry standards with high availability of form factors," said Samson Chang.

For the FPGA market with current annual sales of $ 5.8 billion annually, an average annual growth rate of 7.6% is expected over the next five years, mainly driven by innovations in the areas of AI and IoT. The activities of the industry leaders underline this development. For example, the industry giant, Intel, acquired Altera as one of the leading manufacturers of ASICs at the end of 2015.  In October 2020, AMD announced the purchase of Xilinx, the world’s largest developer and manufacturer of FPGAs.

More information is available at www.innodisk.com.